HDI Materials: Microvias and Lamination Sequence

HDI describes a high-density interconnect board technology; it is not one laminate grade. Material reference.

Microvias and Lamination Sequence

Choose core, prepreg and build-up dielectrics with the intended microvia structure and lamination sequence. A material labelled high performance does not establish microvia reliability by itself. The fabricator's process and the board's thermal exposure need to be assessed with the stackup.

Manufacturing and acceptance checks

Provide via structure, dielectric thickness, line and space requirements and assembly profile. Ask for exact material grades and a fabrication review. Define cross-section, electrical and reliability acceptance where required, and approve substitutions only with their effect on the full process documented.

Compare related options

• Build-up Materials
• High TG FR4
• RCC Materials

Reference and scope

Isola: PCB laminate and prepreg material selection provides material or specification background. The checks above are purchasing guidance; final acceptance values must come from the agreed grade, product specification and condition.

Send a drawing and material requirements for review. Include quantity, critical dimensions and the inspection evidence required with delivery.