Build-up Materials: Packaging Films and PCB Dielectrics

Build-up materials include dielectric products used to add fine interconnect layers. Ajinomoto ABF is a packaging-substrate film example. Material reference.

Packaging Films and PCB Dielectrics

Distinguish semiconductor-package substrates from conventional HDI PCBs before selecting a film. Do not transfer ABF product data to every build-up dielectric or assume a fabricator can process an unfamiliar material. The fine-line, via and metallization route determines the relevant comparison.

Manufacturing and acceptance checks

Specify the application, exact film grade, thickness and required line and via geometry. Ask the fabricator to confirm lamination, laser and metallization compatibility. Define adhesion, electrical and thermal-reliability tests for the resulting construction and retain traceability of the qualified material and process.

Compare related options

• HDI Materials
• RCC Materials

Reference and scope

Ajinomoto: build-up film and package-substrate construction provides material or specification background. The checks above are purchasing guidance; final acceptance values must come from the agreed grade, product specification and condition.

Send a drawing and material requirements for review. Include quantity, critical dimensions and the inspection evidence required with delivery.